The current high end AMD parts are multi chip modules. The CPU dies are made at TSMC in 7nm but the IO dies that glue multiple CPU dies together is made in the Global Foundries 14nm process.
GF has basically given up on 10nm and smaller nodes.
Didn't AMD have contractual obligations to use Global Foundries for their high end chips from when they split, or something along those lines? I guess that turned out really well for them, though, since that might have led to the necessity of chiplet designs.
GF has given up on research and pioneering smaller nodes. Their current process is based on tech they licensed from Samsung. I would not be surprised if they licensed another process from TSMC or Samsung in the future.
GF has basically given up on 10nm and smaller nodes.