The real problem is latency in modifications of advanced IC design. To quickly iterate a design, it's not enough to have the 'standard' components available. Many breaking technologies rely on designs utilizing the latest versions (or custom made) ICs, which are simply not available at the same time in the US/EU compared with China.
Rationale: you now just need to bulk order the raw materials / components and "feed the machine".
We aren't there yet, but jeez we seem to be racing there quick?